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Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations

机译:电路分析以预测电子设备中与湿度相关的故障-方法和建议

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摘要

Aim of this paper is to demonstrate the use of circuit analysis to predict humidity robustness of an electronic circuit design. There is a lack of design tools which can predict failures due to humidity, especially the effect of humidity on electrical functionality of circuits. This work provides a methodology for utilising circuit simulation tools to detect humidity related faults associated with a circuit design by using experimentally determined leakage current data or surface insulation resistance using test pattern or model circuits. Simulation of circuits was performed with the experimentally determined SIR value as a parasitic resistance across two nodes of the circuit. Commonly used circuits such as a differential amplifier and a non-inverting comparator were analysed by this methodology. Based on the analysis, circuits with higher humidity robustness have been suggested as examples to demonstrate the effectiveness of this methodology. Finally, the correlation between the properties of the water layer on SIR pattern and actual components was done, which further demonstrates the applicability of the methodology.
机译:本文的目的是演示使用电路分析来预测电子电路设计的湿度鲁棒性。缺乏设计工具可以预测由于湿度引起的故障,尤其是湿度对电路电气功能的影响。这项工作提供了一种方法,该方法可利用电路仿真工具通过使用实验确定的漏电流数据或使用测试图案或模型电路的表面绝缘电阻来检测与电路设计相关的湿度相关故障。使用实验确定的SIR值作为电路两个节点上的寄生电阻进行电路仿真。通过这种方法分析了诸如差分放大器和同相比较器之类的常用电路。根据分析,已提出具有较高湿度鲁棒性的电路作为示例,以证明该方法的有效性。最后,完成了SIR图上水层特性与实际分量之间的相关性,这进一步证明了该方法的适用性。

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