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Investigation on the degradation indicators of short-circuit tests in 1.2 kV SiC MOSFET power modules

机译:1.2 kV SiC MOSFET功率模块短路测试的退化指标研究

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This paper provides a comprehensive investigation on both static characteristics and short-circuit performance of 1.2 kV SiC MOSFET power modules with 2nd generation planar technology. The experimental approach is based on the static characteristics measurements and the short-circuit tests with gradual increase of pulse time duration. If any variation of the static characteristics appears, the time duration of next short-circuit tests would keep the same with the last pulse duration (approach 1) or increase continuously (approach 2). The results of the short-circuit waveforms show a gate degradation which is further confirmed with the measurement of the gate leakage current. Additionally, other degradation indicators, including positive shift of threshold voltage, drain leakage current and on-state resistance increase are evidenced and discussed in this paper. These can be used for early prediction of the degradation and failure in the short-circuit conditions.
机译:本文利用第二代平面技术对1.2 kV SiC MOSFET功率模块的静态特性和短路性能进行了全面研究。实验方法基于静态特性测量和短路测试,随着脉冲持续时间的逐渐增加。如果出现静态特性的任何变化,则下一次短路测试的持续时间将与上一个脉冲持续时间(方法1)保持不变,或者持续增加(方法2)。短路波形的结果表明栅极劣化,这通过栅极泄漏电流的测量进一步得到证实。此外,本文还证明并讨论了其他退化指标,包括阈值电压的正向偏移,漏极泄漏电流和导通电阻的增加。这些可以用于早期预测短路条件下的退化和故障。

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