Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples via FE-simulation of power cycles

摘要

The lifetime of power electronics modules is most often determined via analytical models which use accelerated test results as input. These lifetime tests usually assume experience-derived largely conservative values for the load pulse length, (so-called tontimes), which leads to time/resource-consuming trial-and-error calibration work. Another way of investigating the effect of the thermo-mechanical stress on the components is to use numerical models to simulate the aforementioned tests. This work analyses the influence of the temperature swing and of the load pulse length (ton) on the lifetime of a representative sintered/soldered chip-on-substrate sample by means of the finite element method and sensitivity analysis.