首页> 外文期刊>Microelectronics & Reliability >Application of Scanning Microwave Microscopy nano-C-V to investigate dopant defect under a poly gate device
【24h】

Application of Scanning Microwave Microscopy nano-C-V to investigate dopant defect under a poly gate device

机译:扫描微波显微镜nano-C-V在多晶硅栅器件下研究掺杂物缺陷的应用

获取原文
获取原文并翻译 | 示例

摘要

Scanning Microwave Impedance Microscopy (sMIM) and SCM are used to investigate an intermittent process failure identified as a N-type ghost defect. Two samples are investigated, a control and the failed device, using standard contact mode dC/dV (scanning capacitance microscopy equivalent) and non-resonant imaging with local C-V sweeps. It is shown that SCM and sMIM dC/dV are not conclusive in identifying the defect; but imaging with localized Capacitance versus Voltage (C-V) curves was able to identify and characterize a dopant defect. The suspected failure was located under a section of the gate. N-type carriers in the failure location were only visible when the system was negatively biased and were not present in an identically prepared control sample that exhibited normal device electrical behavior.
机译:扫描微波阻抗显微镜(sMIM)和SCM用于调查被识别为N型重影缺陷的间歇性过程故障。使用标准的接触模式dC / dV(等效于扫描电容显微镜)和带有局部C-V扫描的非共振成像,研究了两个样本,即对照组和失效装置。结果表明,SCM和sMIM dC / dV在确定缺陷方面不是结论性的。但是使用局部电容与电压(C-V)曲线成像可以识别并表征掺杂剂缺陷。疑似故障位于闸门的下方。仅当系统受到负偏压时,故障位置的N型载流子才可见,并且在显示正常器件电性能的相同制备的对照样品中不存在。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号