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首页> 外文期刊>Microelectronics journal >Performance comparison of state-of-the-art heterojunction bipolar devices (HBT) based on AlGaAs/GaAs, Si/SiGe and InGaAs/InP
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Performance comparison of state-of-the-art heterojunction bipolar devices (HBT) based on AlGaAs/GaAs, Si/SiGe and InGaAs/InP

机译:基于AlGaAs / GaAs,Si / SiGe和InGaAs / InP的最新异质结双极器件(HBT)的性能比较

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This paper presents a comprehensive comparison of three state-of-the-art heteroj unction bipolar transistors (HBTs); the AlGaAs/GaAs HBT, the Si/SiGe HBT and the InGaAs/InP HBT. Our aim in this paper is to find the potentials and limitations of these devices and analyze them under common Figure of Merit (FOM) definitions as well as to make a meaningful comparison which is necessary for a technology choice especially in RF-circuit and system level applications such as power amplifier, low noise amplifier circuits and transceiver/receiver systems. Simulation of an HBT device with an HBT model instead of traditional BJT models is also presented for the AlGaAs/GaAs HBT. To the best of our knowledge, this work covers the most extensive FOM analysis for these devices such as Ⅰ-Ⅴ behavior, stability, power gain analysis, characteristic frequencies and minimum noise figure. DC and bias point simulations of the devices are performed using Agilent's ADS design tool and a comparison is given for a wide range of FOM specifications. Based on our literature survey and simulation results, we have concluded that GaAs based HBTs are suitable for high-power applications due to their high-breakdown voltages, SiGc based HBTs are promising for low noise applications due to their low noise figures and InP will be the choice if very high-data rates is of primary importance since InP based HBT transistors have superior material properties leading to Terahertz frequency operation.
机译:本文对三种最新的异质结双极晶体管(HBT)进行了全面比较。 AlGaAs / GaAs HBT,Si / SiGe HBT和InGaAs / InP HBT。本文的目的是发现这些器件的潜力和局限性,并根据常见的品质因数(FOM)定义对其进行分析,并进行有意义的比较,这对于选择技术特别是在RF电路和系统级而言是必要的功率放大器,低噪声放大器电路和收发器/接收器系统等应用。还针对AlGaAs / GaAs HBT提出了用HBT模型代替传统BJT模型对HBT设备进行仿真的方法。据我们所知,这项工作涵盖了这些设备的最广泛的FOM分析,例如Ⅰ-Ⅴ特性,稳定性,功率增益分析,特征频率和最小噪声系数。使用安捷伦的ADS设计工具对器件进行DC和偏置点仿真,并针对各种FOM规格进行了比较。根据我们的文献调查和模拟结果,我们得出结论,基于GaAs的HBT由于其高击穿电压而适合于高功率应用,基于SiGc的HBT由于其低噪声系数而有望用于低噪声应用,而InP高数据速率的选择至关重要,因为基于InP的HBT晶体管具有优异的材料性能,可实现太赫兹频率操作。

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