Photomask patterning: the influence of substrate bulk heating on placement accuracy

摘要

To create precise patterns on a photomask, it is necessary to identify every source of patterning error and strive to reduce each one. In the current work, the effects of system hardware (typical of MEBES systems) on the bulk heating of a SiO_2 substrate have been closely investigated using numerical finite element (FE) analysis and laboratory experiments. Direct temperature measurements of a thermally loaded substrate were performed to determine the thermal response of the photomask substrate.