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首页> 外文期刊>Microelectronic Engineering >The effect of thickness on the dielectric properties of highly (111) oriented Pb(Zr_(0.53)Ti_(0.47))O_3 thin films prepared by a simple sol-gel route
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The effect of thickness on the dielectric properties of highly (111) oriented Pb(Zr_(0.53)Ti_(0.47))O_3 thin films prepared by a simple sol-gel route

机译:厚度对通过简单溶胶-凝胶法制备的高(111)取向Pb(Zr_(0.53)Ti_(0.47))O_3薄膜介电性能的影响

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摘要

Lead zirconate titanate Pb(Zr_(0.53)Ti_(0.47))O_3 (PZT) ferroelectric thin films of various thicknesses were grown on Pt(111)/Ti/SiO_2/Si(100) substrates by a simple sol―gel process, without reflux or high temperature distillation to remove water. The thin films were annealed at 550―600 ℃ in an oxygen atmosphere by rapid thermal annealing (RTA), and highly (111)-oriented PZT thin films have been obtained. The microstructure and surface morphologies of the thin films have studied by X-ray diffraction (XRD) and atomic force microscopy (AFM). AFM images shown that the highly (111) oriented PZT thin films on Pt/Ti/SiO_2/Si substrates with grain sizes of 0.2―0.3 and 2―3 μm, and root mean square roughnesses of 0.92 and 34 nm, for PZT films with thicknesses of 0.3 and 0.56 μm, respectively. The remanent polarization (P_r) and coercive electric field (E_c) values were 32.2 μC/cm~2 and 79.9 kV/cm, 27.7 μC/cm~2 and 54.4 kV/cm; at 100 kHz, the dielectric constant and dissipation factor were 539 and 0.066, 821 and 0.029, respectively, for PZT films with thicknesses of 0.3 and 0.56 μm.
机译:通过简单的溶胶-凝胶法在不使用Pt(111)/ Ti / SiO_2 / Si(100)的衬底上生长各种厚度的锆酸钛酸铅Pb(Zr_(0.53)Ti_(0.47))O_3(PZT)铁电薄膜。回流或高温蒸馏以除去水。通过快速热退火(RTA)在氧气气氛中将薄膜在550-600℃退火,从而获得了高度(111)取向的PZT薄膜。通过X射线衍射(XRD)和原子力显微镜(AFM)研究了薄膜的微观结构和表面形态。原子力显微镜图像显示,在Pt / Ti / SiO_2 / Si衬底上具有高度(111)取向的PZT薄膜,晶粒尺寸为0.2〜0.3和2〜3μm,均方根粗糙度为0.92和34 nm。厚度分别为0.3和0.56μm。剩余极化强度(P_r)和矫顽电场强度(E_c)分别为32.2μC/ cm〜2和79.9 kV / cm,27.7μC/ cm〜2和54.4 kV / cm;在100 kHz下,厚度为0.3和0.56μm的PZT薄膜的介电常数和耗散系数分别为539和0.066、821和0.029。

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