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首页> 外文期刊>Microelectronic Engineering >Potential of air gap technology by selective ozone/TEOS deposition: Effects of air gap geometry on the dielectric constant
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Potential of air gap technology by selective ozone/TEOS deposition: Effects of air gap geometry on the dielectric constant

机译:选择性臭氧/ TEOS沉积产生气隙技术的潜力:气隙几何形状对介电常数的影响

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摘要

Air gaps offer an interesting alternative to low-k or ultra-low-k materials in order to reduce the line-to-line capacitance in a metallization system. A possible approach for air gap fabrication is based upon selective ozone/TEOS deposition. Feasibility of this method will be shown and capacitance reductions by almost 50% will be demonstrated. The potential for further reduction can be scanned by theoretical modelling of the line-to-line capacitance. The results indicate that effective k values below 2 are reachable by air gaps even if conventional materials like oxide and nitride are used in the process.
机译:气隙为低k或超低k材料提供了一种有趣的替代方法,以减少金属化系统中的线间电容。气隙制造的一种可能方法是基于选择性的臭氧/ TEOS沉积。将显示该方法的可行性,并将证明电容降低了近50%。可以通过对线间电容进行理论建模来扫描进一步减小的可能性。结果表明,即使在该过程中使用了诸如氧化物和氮化物之类的常规材料,气隙也可以达到低于2的有效k值。

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