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Structure analysis and property improvements of the computer-simulated fullerene-based ultralow-k dielectrics

机译:计算机模拟的基于富勒烯的超低k电介质的结构分析和性能改进

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摘要

We have recently proposed new ultralow-k dielectric materials using a theoretical approach called molecular design. This approach requires the application of complementary theoretical methods to describe the complex problems. The methods include classical, continuum theoretical, and quantum-chemical approximations. The advantage of the present approach is that various possible candidates for ultralow-k dielectrics can be tested theoretically without performing expensive and time-consuming experiments. In this study, we analyze the way to connect linker molecules to the node molecules, in order to improve mechanical and dielectric properties of generated ultralow-k structures. Two different types of bonding linker molecules to the cage C_(60) molecule with the >C=C< and >C-CH_2-CH_2-C< linker molecules are possible. It is shown that at the present improvement step it is possible to get property combinations with dielectric constant of k = 2.2 and bulk modulus of B = 33 GPa for the simple cubic topology.
机译:我们最近使用一种称为分子设计的理论方法提出了新的超低k介电材料。这种方法需要应用互补的理论方法来描述复杂的问题。这些方法包括经典,连续理论和量子化学近似。本方法的优点是,在不执行昂贵且费时的实验的情况下,可以从理论上测试超低k电介质的各种可能的候选物。在这项研究中,我们分析了将连接分子连接到节点分子的方法,以提高生成的超低k结构的机械和介电性能。具有> C = C <和> C-CH_2-CH_2-C <接头分子的两种不同类型的键合接头分子与笼型C_(60)分子是可能的。结果表明,在当前的改进步骤中,对于简单的立方拓扑结构,可以得到介电常数为k = 2.2且体积模量为B = 33 GPa的特性组合。

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