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机译:使用牺牲基板和热活化溶剂键合技术用金微电极制造塑料微芯片
Institute of Chemical Technology Prague, Department of Chemical Engineering, Technicka 5, 166 28 Praha 6, Czech Republic;
Institute of Chemical Technology Prague, Department of Chemical Engineering, Technicka 5, 166 28 Praha 6, Czech Republic;
Institute of Chemical Technology Prague, Department of Chemical Engineering, Technicka 5, 166 28 Praha 6, Czech Republic;
Institute of Chemical Technology Prague, Department of Chemical Engineering, Technicka 5, 166 28 Praha 6, Czech Republic;
Institute of Chemical Technology Prague, Department of Chemical Engineering, Technicka 5, 166 28 Praha 6, Czech Republic;
Institute of Chemical Technology Prague, Department of Chemical Engineering, Technicka 5, 166 28 Praha 6, Czech Republic;
micro-electrode; micro-electrode array; sacrificed substrate; solvent bonding;
机译:碳微电极的微成型技术制备及其在基于微芯片的流动分析中的应用
机译:毛细管技术中化学沉积和微成型技术在电泳微芯片上制备用于电化学检测的集成微电极
机译:在塑料基板上低成本制造微电极
机译:结合微磨削和液体基溶剂粘合,用于塑料微芯片的超快速制造
机译:用于塑料衬底上的GSZO TFT的研究
机译:可溶液加工的金属种子水热生长法在柔性塑料基板上低温大面积制备ZnO纳米线
机译:用于聚合物和聚合物 - 玻璃微芯片器件制造的热,粘合剂和溶剂粘合技术
机译:通过温和热和光化学分解产生的中间体活化C-H键金属环(C5me5)Ir(C(p-CIC6H4)= NOC(= O)(共)在烃类溶剂中