Advanced Metallization Conference 2010 a conference in two sites: AMC 2010 -Albany, NY, October 5-7, 2010 and the ADMETA 2010 - Tokyo, October 19-22, 2010

摘要

The Advanced Metallization Conference took place at the College of Nanoscale Nanoscience and Engineering at the State University of New York, Albany, New York, October 5-7, 2010. The conference was organized by the co-chairs: Dr. Tokei Zsolt, IMEC, Leuven, Belgium, and Dr. Cindy Goldberg of STMicroelectronics at IBM East Fishkill, New York. The conference was supervised by an international executive committee that includes 24 distinguished researchers from the field of interconnect technology. The conference was held in parallel with the Advanced Metallization conference in Tokyo (ADMETA 2010, the 20th Asian session, that took place in Sanjou Hall, University of Tokyo, Tokyo in October 19-22 2010). Seiichi Kondo (Renesas Electronics) was the chairman, and Eiichi Kondoh (Yamanashi University) was the program chairman of the ADMETA 2010 meeting. A local committee and the international committee supervised the ADMETA meeting. Both conferences offer an excellent opportunity to learn about the most recent R&D activities in interconnect metal deposition and related fields from around the world.