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首页> 外文期刊>Microelectronic Engineering >Gate-last integration on planar FDSOI for low-V_(Tp) and low-EOT MOSFETs
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Gate-last integration on planar FDSOI for low-V_(Tp) and low-EOT MOSFETs

机译:适用于低V_(Tp)和低EOT MOSFET的平面FDSOI上的后栅极集成

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摘要

We integrated planar fully depleted (FD) SOI MOSFETs with a gate-last on high-k first (GL-HKF) down to gate lengths of Lg = 15 nm and active widths of W = 80 nm. Such an integration scheme enables reaching for pMOSFETs a threshold voltage of V_(Tp) = 0.2 V and one decade gate current (J_G) gain, as well as similar hole mobility and ON-currents, compared to pMOSFETs integrated with a gate first. This approach is also benchmarked with high-k last (GL-HKL) stacks in terms of leakage, equivalent oxide thickness (EOT), effective work-function (EWF) and flat band voltage (V_(FB)) shift under stress.
机译:我们集成了平面全耗尽(FD)SOI MOSFET,并在高k优先(GL-HKF)上实现了后栅极,其栅极长度为Lg = 15 nm,有效宽度为W = 80 nm。与先集成栅极的pMOSFET相比,这种集成方案能够使pMOSFET的阈值电压达到V_(Tp)= 0.2 V,栅极电流(J_G)增益达到十倍,并且空穴迁移率和导通电流也相似。该方法还以高k最后(GL-HKL)堆叠为基准,涉及泄漏,等效氧化物厚度(EOT),有效功函数(EWF)和应力下的平带电压(V_(FB))偏移。

著录项

  • 来源
    《Microelectronic Engineering》 |2013年第9期|306-309|共4页
  • 作者单位

    CEA, LETI. MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France;

    CEA, LETI. MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France;

    CEA, LETl. MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France;

    CEA, LETI. MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France;

    CEA, LETI. MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    MOSFET; SOI; Replacement gate; EOT; Metal gate work function;

    机译:MOSFET;所以我;更换门;EOT;金属门功功能;

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