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机译:HfO_2 / Si_3N_4带隙工程俘获层提高了多晶硅闪存器件的编程和擦除速度
Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan, ROC;
Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan, ROC;
Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan, ROC;
Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan, ROC;
Poly-Si; Nanowire; Bandgap-engineering; HfO_2; Si_3N_4; Flash memory;
机译:(HfO_2)_X(Al_2O_3)_(1-X)/ SiO_2双层阻挡氧化物对电荷陷阱存储器件中编程和擦除速度的影响
机译:SiO_2隧穿和Si_3N_4 / HfO_2俘获层是通过低温工艺在全栅无结电荷俘获闪存器件上形成的
机译:具有由低温富氮SiN / SiO_2叠层形成的隧穿层的电荷俘获闪存器件的提高的编程/擦除速度
机译:具有SiGe埋入沟道的电荷陷阱闪存器件的编程和擦除速度的提高
机译:闪存可擦可编程只读存储设备中的热载流子效应。
机译:Nb2O5和Ti掺杂Nb2O5电荷陷阱纳米层在闪存中的应用
机译:多层石墨烯纳米带闪存:分析 编程和擦除操作
机译:摩托罗拉mC68040采用altera Epm5000可擦写可编程逻辑器件进行高速设计