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Optimal process integration of gate insulator and a-Si layers in large-sized a-Si thin-film-transistor

机译:大型a-Si薄膜晶体管中栅极绝缘层和a-Si层的最佳工艺集成

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An optimal process integration on the gate insulator (GI) and intrinsic a-Si layer of large-sized amorphous silicon thin film transistor (a-Si TFT) is proposed in this work to effectively reduce off current (I-off) and threshold voltage (V-th) shift under high and low electrical-field stresses. The proposed optimal integration is to apply the better deposition conditions of gate insulator (GI) and a-Si layer. It is experimentally found that the I-off of large-sized a-Si TFT with the optimal integration can be reduced by at least 50%, and the Vth shift (Delta V-th) after high and low electrical-field stresses can also be reduced by around 40%. (C) 2015 Elsevier B.V. All rights reserved.
机译:这项工作提出了在栅极绝缘体(GI)和大型非晶硅薄膜晶体管(a-Si TFT)的本征a-Si层上的最佳工艺集成,以有效降低截止电流(I-off)和阈值电压高和低电场应力下的(V-th)位移。提出的最佳集成是为了应用更好的栅极绝缘体(GI)和a-Si层沉积条件。实验发现,具有最佳集成度的大型a-Si TFT的I-off可以降低至少50%,并且在高和低电场应力后的Vth偏移(Delta V-th)也可以降低减少约40%。 (C)2015 Elsevier B.V.保留所有权利。

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