机译:使用微拉曼光谱和原子力显微镜对铜直通硅通孔(Cu-TSV)进行热机械表征
Tech Univ Chemnitz, Semicond Phys, D-09126 Chemnitz, Germany|Fraunhofer ENAS, Micro Mat Ctr, D-09126 Chemnitz, Germany;
Fraunhofer ENAS, Micro Mat Ctr, D-09126 Chemnitz, Germany;
Tech Univ Chemnitz, Semicond Phys, D-09126 Chemnitz, Germany;
Tech Univ Chemnitz, Semicond Phys, D-09126 Chemnitz, Germany;
Tech Univ Chemnitz, Semicond Phys, D-09126 Chemnitz, Germany;
Fraunhofer ENAS, Micro Mat Ctr, D-09126 Chemnitz, Germany;
Fraunhofer ENAS, Micro Mat Ctr, D-09126 Chemnitz, Germany;
Copper through-silicon via (Cu-TSV); Coefficient of thermal expansion (CIE) mismatch; Raman frequency shift; Annealing effect; Cu via protrusion; Atomic force microscopy (AFM);
机译:澄清通过铜填充硅通孔周围硅中的多波长微拉曼光谱法测量的应力场
机译:结合原子力显微镜和偏振显微拉曼光谱表征单过渡金属氧化物纳米棒
机译:结合原子力显微镜和偏振显微拉曼光谱表征单过渡金属氧化物纳米棒
机译:澄清通过多波长微拉曼光谱法测量的铜填充硅通孔(tsvs)周围硅中的应力场
机译:电沉积的壳聚糖膜的原子力显微镜和拉曼光谱表征。
机译:DOPC和DPPC支持的平面脂质双层的制备用于原子力显微镜和原子力光谱
机译:原子力显微镜和显微拉曼光谱研究在硅衬底上沉积的酞菁铁薄膜的取向研究