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首页> 外文期刊>Microelectronic Engineering >Improved performance of gate-last FDSOI tunnel field-effect-transistors (TFETs) with modulating Al2O3 composition in atomic layer deposited HfAlOx gate dielectrics
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Improved performance of gate-last FDSOI tunnel field-effect-transistors (TFETs) with modulating Al2O3 composition in atomic layer deposited HfAlOx gate dielectrics

机译:在原子层沉积的HfAlOx栅极电介质中通过调制Al2O3成分来改善后栅极FDSOI隧道场效应晶体管(TFET)的性能

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摘要

We have studied the electrical characteristics of both n-type and p-type fully depleted silicon on insulator (FDSOI) tunnel field-effect transistors (TFETs) by modulating Al2O3 fraction (25%, 50%) within atomic layer deposited HfAlOx gate dielectric. Compared to HfO2 alone, lower subthreshold swing (S.S), higher I-on,/I-off, and stronger threshold voltage (V-th) immunity against electrical stress are obtained for both n-type and p-type TFETs by adopting nano-laminated atomic layer deposited HfAlOx, attributed to the increased band gap and interfacial layer scavenging effect. (C) 2017 Elsevier B.V. All rights reserved.
机译:我们已经通过调制原子层沉积的HfAlOx栅极电介质中的Al2O3比例(25%,50%)来研究n型和p型完全耗尽型绝缘体上硅(FDSOI)隧道场效应晶体管(TFET)的电学特性。与单独使用HfO2相比,通过采用纳米技术,n型和p型TFET均获得了更低的亚阈值摆幅(SS),更高的I-on,/ I-off和更强的阈值电压(V-th)抗电应力能力。 -层合的原子层沉积的HfAlOx,归因于带隙的增加和界面层的清除作用。 (C)2017 Elsevier B.V.保留所有权利。

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