首页> 外文期刊>Microelectronic Engineering >Electromigration and Mechanical Stress
【24h】

Electromigration and Mechanical Stress

机译:电迁移和机械应力

获取原文
获取原文并翻译 | 示例
       

摘要

The state of the art in the understanding of electromigration failure and mechanical stress is reviewed. First, the important concepts are introduced the effects of thermal stress and the presence of a refractory underlay is shown. Following a simplified way of qualitatively assessing the effect of various geometries on electromigration is proposed.
机译:综述了对电迁移失败和机械应力的了解。首先,介绍了重要概念,并介绍了热应力的影响,并显示了耐火垫层的存在。提出了一种定性地评估各种几何形状对电迁移影响的简化方法。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号