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RF MEMS Membrane Switches on GaAs Substrates for X-Band Applications

机译:用于X波段应用的GaAs基板上的RF MEMS膜开关

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摘要

Micromechanical switches have demonstrated great potential at microwave frequencies. For low-loss applications at microwave frequencies, it is important to use high-resistivity substrates. This paper presents the design and fabrication of the shunt-capacitive MEMS switch on GaAs substrates. Analytical mechanical and impedance models of the membrane switch are given, and the results are confirmed by using the ANSYS and HFSS software, respectively. A surface micromachining process, which is compatible with the conventional millimeter-wave integrated circuits (MMICs) fabrication technology, was adopted to fabricate the RF switch on GaAs substrates. Its S-parameter was taken using a HP8510C vector network analyzer and a Cascade Probe station. The measured insertion loss of the switch and its associated transmission line is less than 0.25 dB from 1 to 25.6 GHz, and the isolation may reach -42 dB at its self-resonate frequency of 24.5 GHz. The actuation voltage is about 17 V. The switch has demonstrated lifetimes as long as 5 × 10{sup}6 cycles. The wideband high performance in isolation and insertion loss offers the monolithic integration capability with GaAs MMICs.
机译:微机械开关在微波频率上显示出巨大的潜力。对于微波频率下的低损耗应用,重要的是使用高电阻率的基板。本文介绍了在GaAs衬底上的并联电容MEMS开关的设计和制造。给出了薄膜开关的力学和阻抗分析模型,并分别使用ANSYS和HFSS软件确认了结果。采用与常规毫米波集成电路(MMIC)制造技术兼容的表面微加工工艺在GaAs衬底上制造RF开关。它的S参数是使用HP8510C矢量网络分析仪和Cascade Probe工作站采集的。在1至25.6 GHz范围内,测得的开关及其相关传输线的插入损耗小于0.25 dB,在24.5 GHz的自谐振频率下,隔离度可能达到-42 dB。激励电压约为17V。该开关的使用寿命长达5×10 {sup} 6个周期。隔离和插入损耗方面的宽带高性能提供了与GaAs MMIC的单片集成能力。

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