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Ultrahigh-Dynamic-Range Resonant MEMS Load Cells for Micromechanical Test Frames

机译:超高动态范围共振MEMS称重传感器,用于微机械测试架

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This paper presents a resonant double-ended tuning fork (DETF) force sensor with an experimentally demonstrated resolution of 7 nN and a compressive load range of 0.08 N, exceeding a dynamic range of 140 dB (100 parts per billion). The resonator has a scale factor of 216 kHz/N, a $Q$ -factor exceeding 60 000 at 3-mtorr ambient pressure, and a zero-load resonant frequency of 47.6 kHz. The resonator is kept at resonance via a phase-locked loop composed of discrete elements. The sensor is implemented with a silicon-on-glass process with a 100-$muhbox{m}$ -thick $langle 111rangle$ silicon structural layer. The sensor and the complete readout circuit are fully embedded in a compact 65 mm $times$ 52 mm printed circuit board (PCB). The out-of-plane parasitic modes of the DETF are also investigated with finite-element simulations and laser Doppler vibrometry experiments, and are verified to be outside of the device working range. The PCB is mounted on a microstage and coupled with an off-the-shelf displacement actuator to realize an economical, versatile, and robust micromechanical test frame with unprecedented combination of force and displacement resolution and range.$hfill$ [2012-0054]
机译:本文介绍了一种共振双端音叉(DETF)力传感器,其在实验中证明的分辨率为7 nN,压缩负载范围为0.08 N,超过了动态范围140 dB(十亿分之100)。该谐振器的比例因子为216 kHz / N,在3毫托的环境压力下的QQ因子超过60 000,零负载谐振频率为47.6 kHz。谐振器通过由分立元件组成的锁相环保持谐振。该传感器是通过玻璃上硅工艺实现的,该工艺具有100-muhbox {m} $厚的langle 111rangle $硅结构层。传感器和完整的读出电路完全嵌入在紧凑的65毫米x 52毫米印刷电路板(PCB)中。还通过有限元模拟和激光多普勒测振实验研究了DETF的平面外寄生模式,并验证了该模式不在器件的工作范围内。 PCB安装在微型平台上,并与现成的位移执行器耦合,以实现经济,通用且坚固的微机械测试框架,其力,位移分辨率和范围达到空前的结合。$ hfill $ [2012-0054]

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