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Using 'on-the-fly' automatic defect classification to enhance yields

机译:使用“即时”自动缺陷分类以提高成品率

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摘要

'On-the-fly' ADC can help accelerate defect classification, leading to rapid corrective actions and enhanced yields. Since development cycle times have continued to shrink as outlined in the National Technology Roadmap for Semiconductors, it has become increasingly important to identify and isolate wafer defects in order to meet yield targets and maintain profitability. Real-time defect capture alone will not improve yield, however; it is necessary to characterize defects and trace them to their sources so that problems with processing tools can be corrected. The more defect information that is quickly available, the more likely it is that appropriate action will be taken expeditiously, enhancing yield and productivity.
机译:“实时” ADC可以帮助加速缺陷分类,从而导致快速的纠正措施并提高良率。正如《国家半导体技术路线图》所概述的那样,由于开发周期时间持续缩短,因此识别和隔离晶片缺陷以达到成品率目标并保持盈利能力变得越来越重要。但是,仅实时捕获缺陷并不能提高良率。有必要对缺陷进行表征并将其追溯到其来源,以便可以纠正加工工具的问题。可以迅速获得的缺陷信息越多,就越有可能迅速采取适当的措施,从而提高产量和生产率。

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