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Evaluating wafer reclaim techniques in emerging copper processes

机译:评估新兴铜工艺中的晶圆回收技术

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Several key developments in the semiconductor industry have led to the unveiling of the first copper intercon-nect-based devices. As the advantages of copper over aluminum drive the semiconductor industry to the widespread use of copper, a big concern is the cost of developing and sustaining copper-related technologies. Regardless of the materials employed, a significant percentage of semiconductor manufacturing costs goes toward the purchase of test wafers. Since the value of a single wafer containing high-end devices can represent tens of thousands of dollars of potential revenue, the importance of using high-quality test wafers throughout a manufacturing facility to maximize yields is unquestionable.
机译:半导体行业的一些关键发展导致了首批基于铜互连的器件的问世。由于铜相对于铝的优势驱使半导体行业广泛使用铜,因此最大的担忧是开发和维护与铜有关的技术的成本。不管采用哪种材料,半导体制造成本中有很大一部分用于购买测试晶圆。由于包含高端设备的单个晶圆的价值可以代表数万美元的潜在收入,因此毫无疑问,在整个制造工厂中使用高质量测试晶圆以最大化产量的重要性。

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