NEW, MATERIALS ROUNDUP

摘要

Two prototype systems for copper interconnect processing have proven so successful that their manufacturer says it has accelerated shipment of the tools and added staff. ACM Research of Fremont, CA, claims key customers have reacted favorably to wafer runs using two advanced copper-process systems introduced last October. The systems, Ultra ECP and Ultra SFP, suit copper metallization requirements from the current 0.13-μm device generation to 0.035-μm linewidths, according to ACM.