Three tool firms target ultrashallow junctions in San Jose submicron technology center

摘要

Three key players in the process equipment arena have teamed up to tackle some of the more daunting challenges in submicron chip manufacturing. Varian Semiconductor Equipment Associates, Ultratech Stepper, and TEL have established a technology center where eventually a team of up to 40 engineers will examine ultrashallow junction formation for making devices at 70-nm and smaller nodes. The center will be located in San Jose, near Ultra-tech's corporate headquarters. The companies announced the launch at a joint news conference on July 15, the day before the start of Semicon West 2001 in San Francisco.