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FAB AUTOMATION/INTEGRATION: Flexibility, Interoperability, Contamination Control among Keys to Highly Automated Factories

机译:FAB自动化/集成:高度自动化工厂的关键因素之间的灵活性,互操作性,污染控制

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摘要

No technological development has pushed the state of fab au-tomation and integration as hard and as far as the transition to 300-mm chip manufacturing. Manual operation and handling have little or no place in the realm of the big wafer. State-of-the-art process tools and fabs include heretofore-unseen levels of automated intrabay and interbay wafer-handling equipment, factory control systems, and other assorted software. Some pundits have gone so far as to forecast that the long-sought-after "lights-out fab" is just around the corner, but those working up close and personal with the new robotic gear and exotic software know that the industry still has a long way to go. In this installment of The Hot Button, we asked the experts for their take on the critical issues facing fab automation and integration, and their answers may surprise you.
机译:直到向300毫米芯片制造过渡时,没有任何技术发展推动着晶圆厂自动化和集成的现状。手工操作和处理在大晶圆片领域几乎没有或根本没有。先进的工艺工具和晶圆厂包括迄今为止从未见过的水平的自动海湾内和海湾间晶圆处理设备,工厂控制系统以及其他各种软件。一些专家甚至预测,人们期待已久的“ lights-out fab”即将来临,但是那些亲密接触新机器人设备和外来软件的人知道该行业仍然有一个还有很长的路要走。在这一期的《热按钮》中,我们请专家对晶圆厂自动化和集成面临的关键问题的看法,他们的答案可能会让您感到惊讶。

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  • 来源
    《Micro》 |2004年第4期|p.30-32|共3页
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  • 作者单位
  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 环境科学、安全科学;
  • 关键词

  • 入库时间 2022-08-18 00:10:47

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