Reviewing Process Technology Challenges

摘要

Process integration and the intro-duction of new materials, tools, and processes continue to be major themes as the industry faces the challenges of 65- and 45-nm technologies. The International Technology Roadmap for Semiconductors (ITRS) has identified an impressive list of challenging technologies and needs, encompassing a host of new processes and materials for both back-end-of-line (BEOL) and front-end-of-line (FEOL) process modules.