FEOL PROCESSING: Resist removal, selectivity, substrate damage top list of surface preparation challenges

摘要

In the May Hot Button, the experts weighed in on what they saw as the critical topics facing the industry in back-end-of-line (BEOL) surface preparation. This issue's discussion focuses on the related yet distinct problems in the front end of the line, where the cleaning, stripping, and conditioning challenges at the 65-, 45-, and 32-nm tech nodes are at least as daunting as those seen in the interconnect process sequences.