机译:化学镀Ni?B沉积物作为电镀铜电极扩散阻挡层的预退火效果
Division of Materials Science and Engineering Hanyang University 17 Haengdang 1-dong Seongdong-gu 133-791 Seoul Korea;
Division of Materials Science and Engineering Hanyang University 17 Haengdang 1-dong Seongdong-gu 133-791 Seoul Korea;
Division of Materials Science and Engineering Hanyang University 17 Haengdang 1-dong Seongdong-gu 133-791 Seoul Korea;
Division of Materials Science and Engineering Hanyang University 17 Haengdang 1-dong Seongdong-gu 133-791 Seoul Korea;
electroless Ni−B deposition; electroplated Cu electrode; diffusion barrier; plasma display;
机译:化学镀Ni-B沉积物作为扩散阻挡层对电镀铜电极的预退火效果
机译:化学沉积在铜互连上的Ni-B,Ni-P扩散势垒的相变
机译:化学沉积在铜互连上的Ni-B,Ni-P扩散势垒的相变
机译:TaN扩散阻挡层上作为互连层的化学沉积Cu膜的特性
机译:通过CVD法在Ni / Cu合金上合成石墨烯并利用石墨烯作为热电器件的扩散阻挡层的生长机理。
机译:人工蜂群算法优化化学镀Ni-P-Cu镀层参数的实验方法
机译:Cu互连的Cu沉积Ni-B扩散屏障Cu扩散的相变