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Optical method for measuring slow crack growth in cementitious materials

机译:测量胶凝材料中缓慢裂纹扩展的光学方法

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The double-torsion (DT) test is commonly used to calculate slow or subcritical crack velocities in (quasi-)brittle engineering materials directly from the measured load relaxation of notched DT-specimens. In cementitious materials a significant part of the recorded load relaxation in the DT-test may be due to specimen creep deformation, and this would then lead to overestimated crack velocities. In this paper we describe a method to optically measure slow crack growth in cementitious materials by carrying out DT-tests under the optical microscope or inside the environmental SEM. Crack tip detection is facilitated by digital image correlation of the time-lapse microscope recordings. DT-tests at 10 % relative humidity in hardened cement paste (with w/c-ratio of 0.4, 0.5 and 0.6) showed that optically measured crack velocities were significantly lower than those calculated from the DT-specimen relaxation. In many experiments the subcritical crack growth rapidly stopped, while an ongoing specimen load relaxation was recorded. At 90 % relative humidity, load-relaxation in the DT-test was much stronger than at 10 % relative humidity, because subcritical cracking and creep-induced relaxation both increase with moisture content.
机译:双扭转(DT)测试通常用于直接从带凹口的DT试样的测得的载荷松弛中直接计算(准)脆性工程材料中的缓慢或亚临界裂纹速度。在胶凝材料中,DT试验中记录的载荷松弛的很大一部分可能是由于试样的蠕变引起的,这将导致裂纹速度的高估。在本文中,我们描述了一种通过在光学显微镜下或在环境SEM内进行DT测试来光学测量水泥质材料中缓慢裂纹扩展的方法。延时显微镜记录的数字图像相关性促进了裂纹尖端的检测。在硬化水泥浆(w / c比为0.4、0.5和0.6)中,相对湿度为10%时的DT测试表明,光学测量的裂纹速度显着低于从DT试样松弛计算得出的裂纹速度。在许多实验中,亚临界裂纹的生长迅速停止了,同时记录了持续的试样载荷松弛。在相对湿度为90%的情况下,DT测试中的负载松弛比在相对湿度为10%的情况下要强得多,这是因为亚临界裂纹和蠕变引起的松弛都随水分含量的增加而增加。

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