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机译:线电极常压等离子体刻蚀切割SiC晶片
Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;
Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;
Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;
Research Center for Ultra-Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;
Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;
Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;
Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan,Research Center for Ultra-Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;
cutting; dicing; atmospheric-pressure plasma; wire electrode; plasma etching;
机译:用大气压等离子体刻蚀工艺用狭缝掩模对SiC晶片进行切块
机译:狭缝大气压等离子体刻蚀SiC晶片高效切块的基础实验
机译:线性场大气压等离子体蚀刻中Si(100)晶片材料去除特性的研究
机译:线电极常压等离子体刻蚀切割SiC晶片
机译:激光切割和蚀刻纺织品和服装设计:在服装设计创作过程中实施激光切割和蚀刻的方法和文档的实验研究。
机译:垂直和斜面结构的SiC蚀刻技术结合了用于各种微电子应用的不同混合气体等离子体
机译:利用常压等离子体等离子体蚀刻背面减薄碳化硅晶片
机译:高密度等离子体蚀刻siC的等离子体化学;电子材料学报