3D analysis of microstructure changes occurring during creep tests of ultra-fine grained materials

摘要

Experiments were conducted to determine microstructure changes occurring during thermal exposure in metals processed by equal-channel angular pressing (ECAP). The ECAP pressing was performed at room temperature by route B_c. Static annealing and constant load creep tests in tension were conducted at 0.3-0.5 T_m. The microstructure was examined by scanning electron microscope combined with focus ion beam - TESCAN LYRA 3 equipped with electron back scatter diffraction (EBSD).