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Correlation of thermo-mechanical properties with microstructure in commercial pure Cu and Cu-Zn alloys studied by positron annihilation

机译:用正电子an没研究商业纯Cu和Cu-Zn合金中热机械性能与微观结构的关系

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摘要

Isochronal annealing of cold-rolled commercial pure copper (99.97%), Cu-28% Zn, and Cu-32% Zn has been investigated between room temperature and 1173 K. The annealing stages have been identified as recovery, partial recrystallization, complete recrystallization and grain growth using Vickers microhardness, positron annihilation lifetime, and doppler broadening of annihilation radiation measurements. The retardation of complete recovery in Cu-Zn alloys is due to the presence of vacancy-Zn complexes.
机译:研究了室温至1173 K之间的冷轧工业纯铜(99.97%),Cu-28%Zn和Cu-32%Zn的等时退火。退火阶段已确定为恢复,部分重结晶,完全重结晶使用维氏显微硬度,正电子an灭寿命和an灭辐射测量的多普勒展宽来实现晶粒和晶粒长大。 Cu-Zn合金中完全恢复的延迟是由于空位-Zn络合物的存在。

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