机译:各向异性晶粒生长对提高<111的纳米丝铜膜粘接强度的影响
Department of Materials Science and Engineering National Chiao Tung University Hsinchu 30010 Taiwan ROC;
Department of Materials Science and Engineering National Chiao Tung University Hsinchu 30010 Taiwan ROC;
Department of Materials Science and Engineering University of California at Los Angeles Los Angeles CA 90095 USA International College of Semiconductor Technology National Chiao Tung University Hsinchu 30010 Taiwan ROC;
Department of Materials Science and Engineering National Chiao Tung University Hsinchu 30010 Taiwan ROC;
Grains and interfaces; Cu-Cu direct Bonding; Anisotropic grain growth; Shear strength;
机译:使用<111>取向的纳米孪晶铜膜进行各向异性晶粒生长以消除铜-铜直接连接中的键合界面
机译:电镀期间反向电流对铜膜的<111的纳米线柱粒度生长的影响
机译:高度(111) - 粒子型铜膜的晶粒生长动力学研究
机译:使用纳米孪晶铜膜的不同(111)表面比率的铜-铜直接键合
机译:锗(111)相变上的铅和铜(111)磁性表面合金上的铁(x)/镍(1-x)的薄膜显微镜观察。
机译:直流电沉积在(111)纳米孪晶Cu膜中各向异性晶粒生长
机译:Cu种子层晶体取向对<111-纳米丝型Cu生长的影响