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首页> 外文期刊>Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing >Interfacial strength development of roll-bonded aluminium/copper metal laminates
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Interfacial strength development of roll-bonded aluminium/copper metal laminates

机译:轧制铝/铜金属层压板的界面强度发展

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摘要

The development of the phases in the interface of roll-bonded Al/Cu metal laminates controls the strength. Phase development as a function of sintering time was monitored via X-ray diffraction and X-ray mapping. Both techniques revealed essentially the same phase presence and highlighted a limitation of X-ray diffraction. Initial rolling reduction has no effect on phase development but does affect the interface thickness.
机译:轧制Al / Cu金属层压板界面的相的发展控制了强度。通过X射线衍射和X射线作图监测作为烧结时间的函数的相发展。两种技术都显示出基本上相同的相存在,并突出了X射线衍射的局限性。初始轧制压下率对相发展没有影响,但确实会影响界面厚度。

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