Thermal, mechanical and shape memory properties of shape memory epoxy resin

摘要

A series of shape memory epoxy resins (SMEPs) were prepared by epoxy and varying content of aromatic amine curing agent, for the purpose of application on space deployable structures. The thermal and mechanical properties of SMEPs were investigated by DSC, DMA and tensile test. Shape memory properties were also studied by an unusual method we called fold-deploy shape memory test. The effects of cross-linking density, recovery temperature and consecutive cycles on the shape memory properties were revealed through systematic variation of these factors. The results showed this series of SMEPs had high shape retention ratio (more than 99.5%) and shape recovery ratio (around 100%). Their T_g varied from 44.7 ℃ to 145.3 ℃, users could choose as individual requirement.