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Joining of SiC with Si infiltrated tape-cast TiB_2-C interlayer: Effect of interlayer composition and thickness on the microstructure and mechanical properties

机译:SiC与浸渗带铸TiB_2-C中间层的结合:中间层组成和厚度对显微组织和力学性能的影响

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摘要

Tape-cast TiB_2-C interlayers with different compositions and thickness were used to bond SiC ceramics via reactive Si infiltration at 1450℃ in vacuum. This method result in strong bonding of SiC bodies by the formation of a dense TiB_2-SiC-Si composite interlayer. Resultant SiC joints show homogeneous phase distribution within the interlayer while heterogeneous one at the interface. The grain growth behavior of reaction formed SiC and TiB_2 grains was observed and discussed in terms of the tape composition and the infiltration process. Average bending strength of SiC joints was measured to be from 360 MPa to 420 MPa and these joints usually fracture from SiC substrate.
机译:用不同成分和厚度的流延TiB_2-C中间层通过真空中1450℃的反应性Si渗透来粘结SiC陶瓷。该方法通过形成致密的TiB_2-SiC-Si复合中间层而使SiC体牢固结合。所得的SiC接头在中间层内显示出均匀的相分布,而在界面处则显示出异相。观察并讨论了反应生成的SiC和TiB_2晶粒的晶粒生长行为,并根据带的组成和渗透过程对其进行了讨论。测得SiC接头的平均抗弯强度为360 MPa至420 MPa,这些接头通常会从SiC基板断裂。

著录项

  • 来源
    《Materials Science and Engineering》 |2011年第2011期|p.580-584|共5页
  • 作者单位

    National Institute of Advanced Industrial Science and Technology (A1ST), 2266-98 Shimo-Shidami, Moriyama-ku, Nagoya 463-8560, Japan;

    National Institute of Advanced Industrial Science and Technology (A1ST), 2266-98 Shimo-Shidami, Moriyama-ku, Nagoya 463-8560, Japan;

    National Institute of Advanced Industrial Science and Technology (A1ST), 2266-98 Shimo-Shidami, Moriyama-ku, Nagoya 463-8560, Japan;

    National Institute of Advanced Industrial Science and Technology (A1ST), 2266-98 Shimo-Shidami, Moriyama-ku, Nagoya 463-8560, Japan;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    joining; silicon carbide; reactive infiltration; microstructure; mechanical properties;

    机译:连接;碳化硅;反应渗透;显微组织;力学性能;

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