Effect of solution temperature on aging behavior and properties of SiCp/Al-Cu-Mg composites

摘要

In this study, the effect of solution temperature on artificial aging kinetics of 15 vol.% SiC particles reinforced 2009A1 (SiCp/2009Al) composite prepared using a powder metallurgy method was investigated by means of microstructural examinations, hardness measurement and DSC analyses. The study indicated that, with increasing the solution temperature from 495 to 560 ℃, while the GP zone formation and dissolution were retarded due to the decreased quenched-in vacancy concentration, the S' precipitation was promoted due to the increased dislocation density. This accelerated the aging kinetics of the composite with increasing the solution temperature from 495 to 560 ℃. Furthermore, the composite which was solutionized at 530 ℃ exhibited the highest peak hardness and tensile strength. The effect of the solution temperature on the aging behavior and tensile properties of the composite was explained in terms of the variation of the microstructual mechanisms.