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Influence of processing parameters on selective laser melted SiCp/AlSi10Mg composites: Densification, microstructure and mechanical properties

机译:工艺参数对选择性激光熔融SiCp / AlSi10Mg复合材料的影响:致密化,微观结构和力学性能

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摘要

SiC particle reinforced Al matrix composites are increasingly applied in the automotive, military, aerospace and electronic encapsulation fields. In this work, SiC particle reinforced AlSi10Mg composites were fabricated by selective laser melting (SLM). The influences of processing parameters, such as laser power, hatching space and scanning speed, on density, microstructure and mechanical properties of the SLMed SiCp/AlSi10Mg composites were investigated systematically. Under the optimal processing parameters, 97.7% relative density of the SLMed composites was achieved. The SiC particles were distributed uniformly in AlSi10Mg matrix. The decomposition of SiC particles occurred during the SLM processing, and there was a reduction tendency of the SiC particle as the laser energy input increased. The microstructure was characterized by optical microscope, scanning electron microscope and X-ray diffraction. Due to the interfacial chemical reaction between SiC and the aluminum matrix, several the reaction products of the needle-shaped phases Al4SiC4 and faceted particles Si were formed, which dispersed in the primary alpha-Al dendrites and alpha-Al + Si eutectic matrix. The continuous and compatible chemical interface between the SiC particles and the matrix were found with no micro-pores or micro-cracks. Compared with the SLMed AlSi10Mg, the microhardness of the SLMed SiCp/AlSi10Mg composites (217.4HV(0.2)) increased, but the tensile strength (341.9 MPa) decreased obviously. The fracture mode of the SLMed composites was mainly brittle fracture. The main reasons for the early failure of the SLMed SiCp/AlSi10Mg composites were the existence of the pores in the aluminum matrix and the SiC particle cracking. At last, a thin-wall part with complicated structure made of 15 wt% SiCp/AlSi10Mg was fabricated successfully.
机译:SiC颗粒增强的Al基复合材料越来越多地应用于汽车,军事,航空航天和电子封装领域。在这项工作中,通过选择性激光熔化(SLM)制备了SiC颗粒增强的AlSi10Mg复合材料。系统研究了激光功率,孵化空间和扫描速度等工艺参数对SLMed SiCp / AlSi10Mg复合材料的密度,微观结构和力学性能的影响。在最佳工艺参数下,SLMed复合材料的相对密度达到了97.7%。 SiC颗粒均匀分布在AlSi10Mg基体中。 SiC颗粒在SLM加工过程中发生分解,并且随着激光能量输入的增加,SiC颗粒有减少的趋势。通过光学显微镜,扫描电子显微镜和X射线衍射对显微组织进行表征。由于SiC与铝基体之间的界面化学反应,形成了针状相Al4SiC4和刻面颗粒Si的几种反应产物,它们分散在主要的Al-Al树枝状晶体和α-Al+ Si共晶基体中。发现SiC颗粒与基体之间的连续且相容的化学界面没有微孔或微裂纹。与SLMed AlSi10Mg相比,SLMed SiCp / AlSi10Mg复合材料(217.4HV(0.2))的显微硬度有所提高,但抗拉强度(341.9 MPa)却明显下降。 SLMed复合材料的断裂模式主要是脆性断裂。 SLMed SiCp / AlSi10Mg复合材料早期失效的主要原因是铝基体中存在气孔和SiC颗粒开裂。最后,成功地制成了由15 wt%SiCp / AlSi10Mg制成的结构复杂的薄壁部件。

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