Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders

摘要

The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn-25Sn-x(0.1-0.4)Cu-y(0.01-0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn-25Sn-xCu-yri solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn-25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn-25Sn-(0.1-0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.