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Au-Cu BIMETALLIC COLLOIDS PREPARED BY COCONDENSATION WITH NONAQUEOUS SOLVENTS

机译:非溶剂共缩聚制备的金铜双金属胶体

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Au-Cu colloids were prepared by chemical liquid deposition (CLD). The metals were evaporated simultaneously to yield atoms, which were solvated to yield bimetal atom mixtures at 77 K, and upon warming, in some cases, stable liquid colloids were formed with a narrow range of particle size. The solvents under study were acetone, 2-butanone, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, diglyme, THF, and DMF. The particle size of the bimetallic colloids ranged from 2l to 48 A. The films or powders were prepared by direct evaporation of the solvents from bimetallic colloids. Microanalysis demon- started that these films contained carbon and hydrogen residues. Infrared spectra showed that hydrocarbon residues were present in the films. Thermal studies demonstrated the low stability of the Au-Cu films. Two or three decomposition temperatures were observed in the thermograms. In most of the films, a total weight loss of l0-l5/100, at 550 deg.C, was registered.
机译:通过化学液体沉积(CLD)制备Au-Cu胶体。同时蒸发金属以产生原子,将其溶剂化以在77 K下产生双金属原子混合物,并且在加热后,在某些情况下,会形成粒径范围狭窄的稳定液态胶体。所研究的溶剂是丙酮,2-丁酮,2-丙醇,2-甲氧基乙醇,2-乙氧基乙醇,二甘醇二甲醚,THF和DMF。双金属胶体的粒径为2l至48A。通过从双金属胶体中直接蒸发溶剂来制备薄膜或粉末。微量分析表明,这些膜含有碳和氢残留物。红外光谱显示膜中存在烃残留物。热学研究证明了金铜膜的低稳定性。在热分析图中观察到两个或三个分解温度。在大多数薄膜中,在550℃记录的总重量损失为l0-15 / 5。

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