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Influence of gate thermal oxide layer on InGaP/InGaAs doping-channel field-effect transistors

机译:栅极热氧化层对InGaP / InGaAs掺杂沟道场效应晶体管的影响

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In this article, the significant effect of a thin gate thermal oxide layer on InGaP/lnGaAs doping-channel field-effect transistors (DCFETs) is first demonstrated. When compared to the conventional InGaP/InGaAs DCFET, the device with the gate thermal oxide layer exhibits a higher gate turn-on voltage and nearly voltage-independent transconductances as the gate-to-source is biased form -0.75 V to 0V, while the maximum transconductance is lower. Experimentally, the transconductance within 90% of its maximum value for gate voltage swing is 1.63V in the gate-oxide device, which is greater than that of 1.35V in the device without the gate thermal oxide layer. Furthermore, it maintains a high drain current level at negative gate bias in the gate-oxide device, which can be attributed that the thermal oxide layer with a considerably large energy gap absorbs more of gate negative voltage and the influence of negative voltage on the gate depleted thickness is relatively slight.
机译:在本文中,首先展示了薄栅热氧化物层对InGaP / InGaAs掺杂沟道场效应晶体管(DCFET)的显着影响。与传统的InGaP / InGaAs DCFET相比,具有栅极热氧化层的器件表现出更高的栅极导通电压和几乎与电压无关的跨导,因为栅极至源极的偏置电压为-0.75 V至0V,而最大跨导较低。实验上,在栅极氧化器件中,跨导在其栅极电压摆幅最大值的90%以内为1.63V,大于在没有栅极热氧化层的器件中为1.35V。此外,它在栅氧化物器件中在负栅偏压下保持了较高的漏极电流水平,这可以归因于具有较大能隙的热氧化物层吸收了更多的栅负电压以及负电压对栅的影响。耗尽的厚度相对较小。

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