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Integrated circuit packaging industry in Taiwan

机译:台湾集成电路封装业

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摘要

The integrated circuit (IC) industry in Taiwan is comprised mainly of IC chip design and fabrication, IC packaging, and system product design and fabrication industries. Fueled by rapid investment and development efforts from government and private sectors, this industry has sustained a rapid growth in recent years becoming one of the most profitable industries among Asian Pacific countries. This paper details Taiwan's IC packaging manufacturing capabilities and its technology trends. It describes the Taiwan IC package industry's ability to maintain favorable competitive leverage in the global business environment. This paper concentrates on two key areas of manufacturing and technology trends to illustrate Taiwan's electronic industry in general: chip-level packages and substrate and its assembly. The requirements for different applications in the future packages are discussed. The reason for the packaging paradigm shifts and associated precautions are also explained.
机译:台湾的集成电路产业主要包括IC芯片设计与制造,IC封装以及系统产品设计与制造行业。在政府和私营部门的快速投资和发展努力的推动下,该行业近年来一直保持快速增长,已成为亚太国家中最赚钱的行业之一。本文详细介绍了台湾的IC封装制造能力及其技术趋势。它描述了台湾IC封装行业在全球商业环境中保持有利的竞争优势的能力。本文主要关注制造和技术趋势的两个关键领域,以总体上说明台湾的电子工业:芯片级封装,基板及其组装。讨论了未来软件包中对不同应用程序的要求。还解释了包装范式转换的原因以及相关的预防措施。

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