SFP+ chip combines PHY functions with EDC

摘要

Shortly before AMCC (www.amcc.com) announced its intention to acquire Quake Technologies, the latter unveiled the QT2035S, an integrated physical layer IC aimed at 10-Gbit Ethernet (10-GbE) SFP+ modules. The device enables the development and deployment of these modules by solving the signal-processing challenges inherent in SFP+ designs through a combination of waveform shaping on the transmit side and electronic dispersion compensation (EDC) on the receive side. The signal-processing capabilities eliminate the requirement for equalizers or retimers within the module, opening the door to devices that could meet short-reach requirements at lower cost than current alternatives.