A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape using the Micro-Molding Method

摘要

Polishing processes are widely used in the glass, optical, die, and semiconductor industries. Chemical-Mechanical Polishing (CMP) is especially becoming one of the most important ULSI processes for the 0.25 μm generation and beyond. CMP is conventionally earned out using abrasive slurry and a polishing pad. But the surface of the pad has irregular pores, so there is non-uniformity in slurry flow and in contact area between wafer and the pad causing glazing on the surface of the pad. This paper introduces the basic concept and fabrication technique of the next generation CMP pad using hydrophilic polymers with swelling characteristics in slurry, and explains the self-conditioning phenomenon and the micro-molding method used to obtain uniform protrusions and pores on the pad surface. Experimental results demonstrated the swelling characteristics, the hardness, and the accuracy of the form of the developed pad.