Surface/Subsurface Damage of Yttria Partially Stabilized Zirconia in Grinding using Monolayer Brazed Diamond Wheel

摘要

A new brazed monolayer diamond grinding wheel is developed with the same continuous cutting edge distance on the wheel surface. Surface/subsurface damage of yttria partially stabilized zirconia (Y-PSZ) in grinding using monolayer brazed diamond wheel is analyzed. In this investigation, the influence of the maximum undeformed chip thickness (h_m) on material removal mechanism is analyzed. The experiment results show that the ground surface is almost in ductile material removal mode when h_m is below the critical value for Y-PSZ, otherwise it will be the combined removal modes of brittle and ductile when h_m is above the critical value.