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Undercut structure fabricated by complementary-structure micropatterning technique for the passive-matrix display of organic light-emitting diodes

机译:通过互补结构微图案化技术制造的底切结构,用于有机发光二极管的无源矩阵显示

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This paper reports a new patterning method, the complementary-structure micropatterning (CSMP) technique, to fabricate the undercut structures for the passive-matrix display of organic light-emitting diodes (OLEDs). First, the polyvinylpyrrolidone (PVP) stripe patterns with a trapeziform cross-section were formed by micromolding in capillaries. Then the photoresist was spin coated on the substrate with the patterned PVP stripes and developed in water. The PVP was dissolved and lifted off from the substrate with the photoresist deposited on it, resulting in the undercut structures of the remaining photoresist. The undercut structures with different configurations were obtained by adjusting the photoresist thickness. The undercut structures were further used as separators in the patterning of the passive-matrix display of OLEDs. No visible performance difference was observed compared with OLEDs patterned by the traditional method.
机译:本文报道了一种新的构图方法,即互补结构微构图(CSMP)技术,以制造用于有机发光二极管(OLED)的无源矩阵显示的底切结构。首先,通过在毛细管中微模形成具有梯形截面的聚乙烯吡咯烷酮(PVP)条纹图案。然后,将光致抗蚀剂旋涂在具有图案化的PVP条纹的基板上,并在水中显影。将PVP溶解并从其上沉积了光致抗蚀剂的基材上剥离下来,从而形成剩余光致抗蚀剂的底切结构。通过调节光致抗蚀剂的厚度获得具有不同构型的底切结构。底切结构还用作OLED的无源矩阵显示器的图案中的分隔物。与通过传统方法构图的OLED相比,没有观察到可见的性能差异。

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