首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures >Gas phase reaction products during tungsten atomic layer deposition using WF6 and Si2H6
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Gas phase reaction products during tungsten atomic layer deposition using WF6 and Si2H6

机译:使用WF6和Si2H6沉积钨原子层期间的气相反应产物

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The gas phase reaction products during tungsten (W) atomic layer deposition (ALD) using WF6 and Si2H6 were studied using quadrupole mass spectrometry. The gas phase reactions products were different for the WF6 and Si2H6 reactions. No surface reactions were observed for WF6 exposures at room temperature. The WF6 reaction produced H-2, HF and SiF4 at a reaction temperature of 473 K. Mass spectrometer cracking patterns established that SiF4 is the silicon reaction product instead of SiHF3. Auger electron spectroscopy (AES) measurements confirmed that the H-2, HF and SiF4 gas phase reaction products during WF6 exposure coincided with the loss of silicon surface species. The Si2H6 reaction showed two separate reaction channels depending on reaction temperature. At room temperature, a temperature insensitive reaction produced SiHF3 and H-2 reaction products. A second reaction produced H-2 as the reaction product at 473 K. AES measurements confirmed that the SiHF3 and H-2 reaction products during Si2H6 exposure were concurrent with the gain of silicon surface species. Together with previous FTIR spectroscopy and AES studies, these mass spectrometer results help to identify the stoichiometry of the surface reactions during the sequential WF6 and Si2H6 exposures that define W ALD. (C) 2004 American Vacuum Society.
机译:使用四极杆质谱法研究了使用WF6和Si2H6沉积钨(W)原子层(ALD)期间的气相反应产物。 WF6和Si2H6反应的气相反应产物不同。在室温下未观察到WF6暴露的表面反应。 WF6反应在473 K的反应温度下产生H-2,HF和SiF4。质谱仪的裂解图谱确定SiF4是硅反应产物而不是SiHF3。俄歇电子能谱(AES)测量证实WF6暴露期间的H-2,HF和SiF4气相反应产物与硅表面物质的损失相吻合。 Si 2 H 6反应根据反应温度显示两个分开的反应通道。在室温下,对温度不敏感的反应会生成SiHF3和H-2反应产物。第二个反应在473 K下产生H-2作为反应产物。AES测量证实,Si2H6暴露过程中SiHF3和H-2反应产物与硅表面物质的增加同时发生。结合先前的FTIR光谱学和AES研究,这些质谱仪的结果有助于确定连续WF6和Si2H6暴露(定义W ALD)期间表面反应的化学计量。 (C)2004年美国真空学会。

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