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Interpretation of current transport properties at Ni-GaN Schottky interfaces

机译:解释Ni / n-GaN肖特基界面上的电流传输特性

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Current transport properties at Ni-GaN Schottky interfaces formed on oxide-etched or thermally oxidized surfaces are studied by current-voltage-temperature (I-V-T) and capacitance-voltage measurements. The results support existence of surface patches with low Schottky barrier height (SBH), which cause a leakage current of the Schottky structures. Based on "surface patch" model, the fraction of the total patch area of 10(-4)-10(-5) and the SBH lowering of 0.4 eV within patches are deduced for the oxide-etched Ni-GaN metalorganic chemical vapor deposition (MOCVD) samples. The influence of surface patches was found much larger for the present Ni-GaN molecular beam epitaxy (MBE) samples. The inclusion of N-polarity domains in the Ga-polarity layer seems to be main origin of the patches for the MBE-grown samples. Ni-GaN Schottky samples formed on dry-oxidized or wet-oxidized MOCVD layers represented reduction of the effective SBH with negligible increase of the n value, indicating that an intermediary native oxide between Ni and n-GaN degrades the SBH. I-V-T characteristics showed that the leakage current due to surface patches is comparable with that of the oxide-etched sample. Concerning thermal stability of the bulk GaN (MOCVD), the impurity concentration in the layer increased after wet oxidation above 500 degreesC, although little change was observed after wet oxidation at temperatures below 400 degreesC. Finally, a postfabrication annealing in nitrogen at 400 degreesC led to increase of the effective SBH even for the oxidized Ni-GaN Schottky samples. (C) 2004 American Vacuum Society.
机译:通过电流-电压-温度(I-V-T)和电容-电压测量研究了在氧化物蚀刻或热氧化表面上形成的Ni / n-GaN肖特基界面上的电流传输特性。结果支持存在具有低肖特基势垒高度(SBH)的表面贴片,这会导致肖特基结构的泄漏电流。基于“表面补丁”模型,推导了氧化物刻蚀的Ni / n-GaN金属有机化合物的总补丁面积比例(10(-4)-10(-5)和SBH降低了0.4 eV)气相沉积(MOCVD)样品。对于当前的Ni / n-GaN分子束外延(MBE)样品,发现表面补丁的影响要大得多。 Ga极性层中包含N极性域似乎是MBE生长样品的贴片的主要来源。在干氧化或湿氧化MOCVD层上形成的Ni / n-GaN肖特基样品表示有效SBH的降低,而n值的增加可忽略不计,表明Ni和n-GaN之间的中间天然氧化物会降低SBH。 I-V-T特性表明,由于表面斑块引起的泄漏电流与经氧化物蚀刻的样品相当。关于块状GaN(MOCVD)的热稳定性,尽管在低于400℃的温度下进行湿氧化后观察到很小的变化,但是在高于500℃的条件下进行湿氧化后该层中的杂质浓度增加了。最后,即使对于氧化的Ni / n-GaN肖特基样品,在氮气中于400摄氏度进行的后加工退火也导致有效SBH的增加。 (C)2004年美国真空学会。

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