首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures >Fabrication of three-dimensional microstructures by two-dimensional slice by slice approaching via focused ion beam milling
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Fabrication of three-dimensional microstructures by two-dimensional slice by slice approaching via focused ion beam milling

机译:通过聚焦离子束铣削通过逐层切入二维切面来制造三维微观结构

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A direct programming control approach for fabrication of three-dimensional (3D) microstructures by-use of focused ion beam (FIB) milling is put forth in this article. The previously reported Vasile mathematical model was simplified by our model of constant dwell time and sputter yield during the milling process. Milling of the 3D microstructures can be transferred to the milling of many discrete two-dimensional (2D) slices with thin and constant thickness. The 3D milling can be completed by the direct FIB 2D milling slice by slice with the same layer thickness. The number of the slices can be determined according to maximum depth of the 3D microstructures. The milling depth for each slice depends on the slice thickness. The simplified model and process parameters can be written in a program code running in the FIB equipped computer. The whole process can be performed automatically after adjusting the focusing status of the ion beam on the sample. It was shown by the experimental results that the method has the advantages of simple mathematical model, less memory space used, and fast milling speed. (C) 2004 American Vacuum Society.
机译:本文提出了一种通过使用聚焦离子束(FIB)铣削制造三维(3D)微观结构的直接编程控制方法。通过我们在研磨过程中的恒定停留时间和溅射产量模型,简化了先前报道的Vasile数学模型。可以将3D微结构的铣削转移到许多薄且恒定厚度的离散二维(2D)切片的铣削中。 3D铣削可以通过直接FIB 2D铣削以相同的层厚逐片完成。切片的数量可以根据3D微结构的最大深度来确定。每个切片的铣削深度取决于切片的厚度。简化的模型和过程参数可以编写为在装有FIB的计算机中运行的程序代码。调整离子束在样品上的聚焦状态后,可以自动执行整个过程。实验结果表明,该方法数学模型简单,存储空间少,铣削速度快。 (C)2004年美国真空学会。

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