Nonorthogonal wafer dicing for waveguide, microelectromechanical systems, and nanotechnology applications

摘要

We propose a technique to dice wafer using photolithography and deep reactive ion etch. We demonstrate our technique by dicing an eight inch wafer into 1.8 x 10(4) pieces of arbitrary shape and size. Our idea is suitable in dicing nano-chips and non-rectangular devices such as waveguide and microelectromechanical systems. (C) 2004 American Vacuum Society.