首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures >Surface potential and morphology issues of annealed (HfO2)(x)(SiO2)(1-x) gate oxides
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Surface potential and morphology issues of annealed (HfO2)(x)(SiO2)(1-x) gate oxides

机译:退火(HfO2)(x)(SiO2)(1-x)栅氧化物的表面电势和形貌问题

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The surface morphology and surface potential variations of annealed (HfO2)(x)(SiO2)(1-x) films were investigated by noncontact atomic force microscopy (AFM) in ultrahigh vacuum. Additional modes of data acquisition included contact potential difference (CPD) and differential capacitance. Two types of samples were investigated. The first, a set consisting of 4 nm thick samples with (HfO2)(x)(SiO2)(1-x) compositions of x = 0.4, 0.6, and 0.8, were annealed at 1000degreesC for 10 s in N-2 gas. The second, a 2.2 nm thick sample of composition (HfO2)(0.78)(SiO2)(0.22) was annealed in vacuum at 50 degreesC intervals from 856 to 1000 degreesC. The anneals resulted in a microstructure consisting of phase-separated HfO2 crystallites and amorphous silica, as observed in high resolution transmission electron microscope (HRTEM) images. The crystallites appear to be responsible for most of the morphology observed with the AFM, with surface features for the hafnium rich x = 0.6 and 0.8 compositions generally agreeing with the crystal sizes observed by HRTEM. The AFM images for the x = 0.4 sample showed substantially broader features than the 5 nm crystallites seen by HRTEM, with evidence for inclusions of low dielectric constant (K) material, presumably silica, on portions of the surface. The vacuum annealed sample showed an initial trend to lower roughness and CPD fluctuation range, with a minimum in both (rms roughness = 0.077 nm and DeltaCPD = 0.2 V) for a 16 s anneal at 900 degreesC. Thereafter both measures increased substantially. The 1000 degreesC vacuum annealed sample compared favorably in structure, roughness, and to a lesser extent in the CPD fluctuation range with the 1000 degreesC N-2 annealed sample. The N2 annealed samples for x = 0.4 and x = 0.8 exhibited CPD fluctuations as large as 0.4 V, with a smaller value of 0.22 V observed for the x = 0.6 sample. CPD fluctuations consist of a small amplitude substructure that correlated with the microstructural features of the surface, superimposed on long range CPD fluctuations (20->50 nm) unrelated to any surface features. Their origin is speculative, but could be associated with bulk and/or interface fluctuations in the density of trapped charge. Their potential adverse impact on device performance is discussed. (C) 2004 American Vacuum Society.
机译:通过非接触原子力显微镜(AFM)在超高真空下研究了退火的(HfO2)(x)(SiO2)(1-x)膜的表面形态和表面电势变化。数据采集​​的其他模式包括接触电势差(CPD)和差分电容。研究了两种类型的样品。首先,将一组由4 nm厚的样品组成,样品中的(HfO2)(x)(SiO2)(1-x)组成x = 0.4、0.6和0.8,在N-2气体中于1000℃退火10 s。将第二个厚度为2.2 nm的成分(HfO2)(0.78)(SiO2)(0.22)的样品在856至1000摄氏度的真空中以50摄氏度的间隔进行退火。如在高分辨率透射电子显微镜(HRTEM)图像中所观察到的,退火产生了由相分离的HfO2晶体和无定形二氧化硅组成的微观结构。微晶似乎是由AFM观察到的大多数形态的原因,富rich x = 0.6和0.8组成的表面特征通常与HRTEM观察到的晶体尺寸一致。 x = 0.4样品的AFM图像显示出比HRTEM观察到的5 nm微晶显着更宽的特征,并有证据表明在部分表面上包含了低介电常数(K)材料,大概是二氧化硅。真空退火样品显示出初始趋势,即降低粗糙度和CPD波动范围,在900℃下进行16 s退火的最低值(均方根粗糙度= 0.077 nm和DeltaCPD = 0.2 V)最低。此后,两项措施均大幅增加。与1000℃N-2退火的样品相比,1000℃真空退火的样品在结构,粗糙度和CPD波动范围内均较差。对于x = 0.4和x = 0.8的N2退火样品,其CPD波动高达0.4 V,对于x = 0.6样品,其CPD波动较小,为0.22V。 CPD波动由与表面的微结构特征相关的小幅度子结构组成,叠加在与任何表面特征均无关的长距离CPD波动(20-> 50 nm)上。它们的起源是推测性的,但可能与捕获电荷密度的体积和/或界面波动有关。讨论了它们对设备性能的潜在不利影响。 (C)2004年美国真空学会。

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